EDEM API - Contact Model Example: Liquid Exchange Model
Overview
The presence of moisture content leads to cohesion due to capillary forces. When liquid surfaces are nearby, a liquid bridge is created leading to an attractive force due to surface tension and the hydrostatic pressure inside the bridge. Moisture content also leads to the development of viscous forces which are secondary to the secondary effect of capillary forces in the case of low moisture content. The present Liquid Bridge model is used to model the effect of the capillary forces. This model does not take into account the effect of viscous force and is therefore only relevant for simulation of a system with low moisture content.
This model also accounts for liquid exchange between two particles in contact due to liquid redistribution during the liquid bridge rupture. The redistribution is not only dependent on the liquid present on both particles, but is also dependent on the wetting angles.
Here you will find the the source code and documentation of the liquid bridge/exchange contact model.
Pre-Requisite
EDEM 2024.0
Usage/Installation Instructions
Please refer to the attached pdf for the equations used in the liquid exchange model.
A preference file is needed which takes the density of the liquid and the time after which the liquid bridge physics must be applied. You must also specify the surface tension of the liquid. Values of wetting angles for all elements (particle names and geometry names) must be specified in the preference file.
The initial liquid content is represented as percent mass of the liquid compared to the mass of the particles. This can be specified in the Factory of the particle.
The zip file contains the source code, and also the compiled library file (.dll) for CPU and the CUDA file (.cu) for GPU.
Post-Requisite
If you wish to use 'Spray Coating' model in conjunction with the liquid bridge model, please refer to this post: https://community.altair.com/community/en/edem-api-contact-model-example-liquid-bridge-cohesion?id=kb_article&sysparm_article=KB0121902
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