Overview
Attached is the source code for the Updated Bond Model using version 3.1 of the API (OpenCL GPU) and version 2.5 of the API (CUDA GPU).
BondedParticle_CM_v3_1_0.zip contains a custom version of the EDEM Bonded V2 model, this is the source code only and needs to be compiled into a library file to run.
BondedParticleCustom_3_5_0.zip is an updated version of the code compiled with an example and also converted to run on CUDA GPU. The two models are not identical. Version 3.1 has options to break in compression (Yes/No), bond damping and ability to extend the contact radii options which are not included in the 3.5 version as they were not commonly used.
V3.5 has the option to break the bond twice and re-bond at a lower or higher strength and stiffness value.
Note neither model is identical to the built in EDEM bonded particle V2 model however they are all based on the same physics model for calculating bond properties and stiffness.
Usage/Installation Instructions
Download BondedParticleCustom_3_5_0.zip
Unzip and with EDEM open test.dem in the example folder
This loads in the BondedParticle_v3_5_0 physics model and reads the associated bonded_particle_prefs.txt file
Run the simulation to see the effects of the bonded particles, the inputs in the .txt file can be modified to change the inputs