The Siemens Community Catalyst program was co-created with our community to acknowledge technology leaders who consistently contribute to the Siemens Community. Nominations are accepted on a rolling basis.
用温挤压工艺生产AZ61B镁合金手机背板，产品外形尺寸1.2*58.3*89.9mm，最大壁厚2mm，最小壁厚0.5mm，求毛坯平板厚度及轮廓尺寸。
