Future.Industry 2023
Accelerating Digital Transformation
At Future.Industry 2023, we’ll explore the latest megatrends impacting our world. From electrification and the data-driven enterprise to AI-driven simulation and semiconductors, you’ll learn how the convergence of simulation, high-performance computing (HPC), and AI can unlock the full potential of your technology investments.
We are rolling our three main events (Future.AI, Future.HPC and Future.Industry) into one. You’ll still hear from premier organizations (such as past presenters: Google, AMD, Intel, Leonardo, Ford, BMW, GE, NVIDIA, Sky TV, VIAN AI, etc.), along with Altair experts and executives, but within the spirit of convergence – you receive faster access to the latest tools and processes all in one place.
This year we will be launching the event in three different time zones each day, so you can watch the presentations at a time that suits you.
APAC: 9:00 AM (New Delhi) / 11:30 AM (Shanghai, Singapore, Kuala Lumpur) / 12:30 PM (Tokyo, Seoul) / 2:30 PM (Sydney)
EMEA: 9:00 AM (London, Lisbon) / 10:00 AM (Paris, Madrid)
AMER: 8:00 AM (Los Angeles) / 10:00 AM (Mexico City) / 11:00 AM (New York) / 1:00 PM (Sao Paulo)
Day 1 the journey will begin by exploring the latest megatrends impacting our world. From electrification and the data-driven enterprise to AI-driven simulation and semiconductors, you’ll learn how the convergence of simulation, high-performance computing (HPC), and AI can unlock the full potential of your technology investments.
Day 2 will break into three parallel tracks as follows:
- Frictionless AI | Operationalize Data and Analytics : Friction can be a big problem when engineers validate components for cars or planes. But it can be just as much of an issue when you are trying to use data to improve your business. Instead of high temperatures and grinding gears, friction in data analytics can lead to failed projects, wasted money, and unnecessary work. Organizations implementing data analytics solutions can have friction between departments and people, technical friction between tools and vendors, or financial friction between aspiration and reality. Often, it is all three. In this track, dive into these big challenges and explore how to overcome them with careful thinking and holistic solutions; equal parts organizational education, technology acceleration, and all-around flexibility.
- Engineering the Future | Physics Simulation and Design : As the world evolves and technology advances, consumers demand products that are connected, sustainable, lightweight, and low cost. Designing and validating innovative products presents unique challenges. Problems like poor antenna placement, overheating printed circuit board (PCB) components, and short-lived batteries can sink a product before it even launches. Next-generation design requires the right mix of features, a compelling user experience, and reduced costs. Finding this balance can take time and money, but today's software tools enable users like never before. In this track, hear how industry experts are engineering the future and optimizing performance across multiple disciplines encompassing structures, motion, fluids, thermal management, electromagnetics, system modeling, embedded systems, and more.
- Next-level HPC | Performance from EDA to Exascale : Optimize your on-premises resources or build an effective strategy for your journey to HPC in the cloud. Access expert insight, keynote presentations, and panel discussions on the latest technologies and topics such as challenges and opportunities in exascale computing, HPC’s impact on sustainability, and the move from jobs to workflows with multidimensional scheduling. Hear from our experts how Altair and our partners optimize EDA environments and improve the design-to-manufacturing process, eliminate design iterations, and — critically — reduce time-to-market.