On a PCBA board, we’re running a solder fatigue calculation using the Blattau method on a BGA component, but the solver is not detecting the PCB–Solder and Solder–Package interfaces.
Note: the exact same model works with the Syed method (same PCB/balls/package sets, and the same TIE contacts PCB/Solder and Package/Solder).
Could you guide us on what needs to be adjusted to resolve the issue?