Hello everyone, I need to simulate a model where laminate A is soldered to PCB board B, and PCB board B is glued to a structural component, then perform thermal stress (deformation) analysis on the entire system. Here are my specific questions:
1. Material Model Selection
- PCB board B and the structural component are represented by MAT1 material.
- Laminate A is a composite material. Initially, I planned to use PCOMP elements, but since one of its layers is orthotropic and PCOMP cannot account for the through-thickness CTE (coefficient of thermal expansion) and modulus, I am considering switching to PCOMPLS elements. Is PCOMPLS the correct choice? Are there any better alternatives?
2. Simulation Error Issue
When simulating with PCOMPLS, the following error occurs during computation:
plaintext
*** ERROR # 7992 *** PROGRAMMING ERROR in TABLEM gtfrtabled ioerr(1) = 2146697216 ioerr(2) = 3
How can I resolve this problem?
3. Mesh Division Question
If PCOMPLS elements are used, can I create multiple layers of mesh in the thickness direction of laminate B? In another simulation model, I need the laminate and adhesive to be tied together, requiring similar mesh sizes between them. However, the mesh size in the thickness direction of laminate B may differ from the thickness of a single ply. Is this feasible?
Thank you very much for your help!
