Temperature Input.

RAMGANESH

Dear All,

 

For the thermal loading under static condition, We can create load collector with card image TEMPD and give T1 value as temperature input.

In Analysis panel , Temperatures, we can create the temperature on the selected nodes and gives values.

 

My question is whether we should give both values same or not ?

 

Thanks

RAM 

Rahul Rajan_21763

TEMPD is for initial condition.see attached screenshot setup for Transient thermal analysis.

<?xml version="1.0" encoding="UTF-8"?>

RAMGANESH

Dear Rahul,

 

Then , can we apply static load and also thermal load then combine it??

 

Thanks for your support

Rahul Rajan_21763

Then it would be case of Coupled thermal structural analysis.Let me check some example for same.

Rahul Rajan_21763

OS-1080: Coupled Linear Heat Transfer/Structure Analysis

RAMGANESH

Dear Rahul,

 

I had gone through the tutorial its fine but along with this i need to consider some range of vibration also.

 

with all these loading conditions i need to find the structural integrity of the model.

 

Thanks

RAM

RAMGANESH

Dear Rahul,

 

Can i do  Coupled Linear Heat Transfer/Structure Analysis  along with vibration loading or not?

 

Thanks

RAM

Rahul Rajan_21763

See attached screenshot.This is what we have mentioned in this post.Check about preloading in userguide.If need relevant let us know.

<?xml version="1.0" encoding="UTF-8"?>

RAMGANESH

Dear Rahul,

 

What should be the card image given to the load collector which has thermal constraint?

 

I am getting following error

  *** ERROR # 1770 ***
  Heat GRID 11841 used with Component 123456 on card SPC 4.

 

Thanks

RAM

Rahul Rajan_21763

No card Image needed for thermal constraint.All dof should be turned off while applying,