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Hello,
it has been a number of years since my last question on the ability of optistruct/radioss to tackle problems of glue failure/delamination of composite structures. Then I saw this presentation from 2016:
http://mtevs.org/images/MTEVS/Projects/CAE/2016-03%20-%20Forum/Altair%20-%20RADIOSS_Moscow_160311_001a.pdf
and the picture from page 22:
Does anyone know if the model depicted is available? This is exactly what I was looking for.
Thank you for your assistance.
Yes, LAW59 is able to model adhesive. /FAIL/CONNECT sometimes is used along with the material card to describe failure behavior.
