Difference between TEMP and TEMP_LOAD Subcase options
HI
I am running a Non Linear Quastatic analysis for an assembly in which one of the components is heat assembled .
To Represent the pre thermal stresses i have given TREF and A value in the MAT1 of the heat assembled component,and applied a temperature(TEMP card) for the same component .
For the remaining all bodies i have given A=0.and temperature is applied with TEMPD.
Now i want to know how can i combine TEMP and TEMPD to be able applied for a subcase .
and i am confused between TEMP and TEMP_LOAD.
can any one please helpme in this.
Answers
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I referred some NASTRAN Reference guides . now I got clarification . Thanks
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Hello mpvnaresh,
I wonder if you could share the reference guides if it is possible. Or could you explain what is the difference.
Best regards,
Muhammet
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