Join Siemens at DAC 2026 for Accelerating semiconductor design with Agentic AI-driven HPC, a Siemens-hosted session on how Agentic AI-driven HPC is helping address growing chip design complexity and accelerate time to tape-out.
Tuesday, July 28 | 8:00 AM – 10:00 AM (Breakfast provided) Long Beach Convention Center
In this session, learn how Siemens EDA’s agentic AI-driven HPC Works platform helps teams upskill faster, design smarter, and reduce tape-out times with intelligent compute.
What you will learn:
- A practical look at how agentic AI and intelligent HPC are reshaping semiconductor design
- Workload management and job scheduling across the design flow
- Full chip flow optimization—and what it means for your tools, teams, and tape-out targets
