The Siemens Community Catalyst program was co-created with our community to acknowledge technology leaders who consistently contribute to the Siemens Community. Nominations are accepted on a rolling basis.
What is QBDY1 and CHBDYE in boundary conditions of thermal analysis
Hi,
These are the inputs required to carryout thermal structural analysis using Optistruct solver.
Heat flux load QBDY1 and convective heat transfer CONV are applied to the structure through surfaces identified by the CHBDYE card. The CHBDYE elements associate heat exchange surfaces with conduction elements.For Detailed information please refer Optistrcut usre guide.
Let us know if want us to share any material wrt to thermal analysis.
Regards
Rahul R
