The Siemens Community Catalyst program was co-created with our community to acknowledge technology leaders who consistently contribute to the Siemens Community. Nominations are accepted on a rolling basis.
What is QBDY1 and CHBDYE in boundary conditions of thermal analysis
Hi,
These are the inputs required to carryout thermal structural analysis using Optistruct solver.
Heat flux load QBDY1 and convective heat transfer CONV are applied to the structure through surfaces identified by the CHBDYE card. The CHBDYE elements associate heat exchange surfaces with conduction elements.For Detailed information please refer Optistrcut usre guide.
Let us know if want us to share any material wrt to thermal analysis.
Regards
Rahul R
Join us for a community conversation on how High-Performance Computing (HPC) and Simcenter PSIM work together to meet the increasing demands of modern power electronics simulation. During this one-hour technical session, you'll discover how leveraging HPC can speed up simulations, improve scalability, and empower engineers…
Join us for a community conversation on accelerating your motor simulation workflow with Simcenter Simlab. In this beginner-friendly session, we'll introduce the platform's automated model-building capabilities and show how easy it is to set up your first electric motor analysis. You'll see the basic steps of geometry…
Join us for a Community Conversation where we'll discuss practical approaches to analyzing complex electromagnetic models using hybrid solver techniques. This session will provide a general overview of how different computational methods can be combined within a single simulation to address models containing varied…