Modelling adhesive with dependency to temperature

Hi all,

I want to perform a simulation of a hybrid structure which is joint by screws and adhesive. The objective is to investigate the behavior of the hybrid materials under thermal load. Therefore I want to ask, whether there is the possibility to give the adhesive area different material cards in dependency to the temperature. So that the adhesive is not stiff at the beginning but inceases its strength according to the temperature.

I want to use Nastran or Optistruct.

Thank you for the help